Name: Gao,Yufei

lecturer, Research Secretary of School of Mech. Eng., SDU

Email:yfgao@sdu.edu.cn

Phone:+(86)0531-88399245-511 (O)

Fax:

Address:Mechanism Design Theory Research Institute, School of Mechanical Engineering, Shandong University. #17923 Jingshi Road, Jinan 250061 P.R. China

Education

Sept.2004- Dec.2009 Ph.D of Mechanical Engineering, Shandong University

Sept.2000-June.2004 Bachelor of Mechanical Engineering, Shandong University

Sept.2008- Aug.2009 Jointly educated Ph.D of Mechanical Engineering,

University of Michigan, Ann Arbor, US

Professional Experience

Mar.2010-date lecturer, Mechanical Engineering, Shandong University

Mar.2010-date Post Doctorate,Materials Science and Engineering, Shandong University

Teaching

Fundamentals of Mechanical Design; Course Design for Fundamentals of Mechanical Design

Special Fields of Interest

Wire saw cut crystal theory and technology

Super-hard abrasive tools manufacturing technology

Research Projects

China Postdoctoral Science Foundation, Shandong Postdoctoral Innovation Foundation and Independent Innovation Foundation of Shandong University.

Scientific and Professional Societies

Selected Publications and Conference Papers (past 5 years)

Yufei Gaoand Peiqi Ge. Analysis of Grit Cut Depth in Fixed-abrasive Diamond Wire Saw Slicing Single Crystal Silicon.Solid State phenomenons. 2011, Vols.175:72-76.

Yufei Gaoand Peiqi Ge. Relationship between the Grit Cut Depth and Process Parameters in Electroplated Diamond Wire Sawing KDP Crystal.Applied Mechanics and Materials.2011, Vols.101-102:950-953.

Gao Yufeiand Ge Peiqi. Study on Influences of Electroplating Process Parameters on Compound Coating Quality of Diamond Wire Saw.Diamond & Abrasives Engineering.2011, 31(5):30- 34.

Huang Bo,Gao Yufeiand Ge Peiqi. Study on Surface Defect and Wire Wear Mechanism of Single Crystal Silicon Electroplated Diamond Wire Saw Slicing.Diamond & Abrasives Engineering.2011, 31(1):53- 57.

Yufei Gaoand Peiqi Ge. Experimental Investigation on Brittle-ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon.Key Engineering Materials. 2010.Vols.431-432:265-268.

Gao Yufei, Ge Peiqi and Li Shaojie. Study on the Machining Performance of Single crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw.JOURNAL OF SYNTHETIC CRYSTALS.2009, 38 (2): 372- 377.

Gao Yufei, Ge Peiqi and Li Shaojie. Prediction and Measurement of Subsurface Damage Thickness of Silicon ingot in WireSaw Slicing.China Mechanical Engineering.2009，Vol. 20(14): 1731-1735.

Yufei Gao, Peiqi Ge and Shaojie Li.Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing.Key Engineering Materials.2009，Vols.416:306-310.

Peiqi Ge,Yufei Gao, Shaojie Li and Zhijian Hou. Study on Electroplated Diamond Wire Saw Development and Wire Saw Wear Analysis.Key Engineering Materials.2009，Vols.416:311-315.

Gao Yufei, Ge Peiqi, Zhao Huili and Zhang Lei.Study on Effects of Monocrystalline Silicon Anisotropy on Slicing Quality Using Fixed-abrasive Wire Saw.China Mechanical Engineering.2008 Vol. 19 (22): 2748-2752.

Yufei Gao, Peiqi Ge, and Zhijian Hou. Study on Removal Mechanism of Fixed-abrasive Diamond Wire Saw Slicing Monocrystalline Silicon.Key Engineering Materials. 2008, Vols.359-360:450-454.